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UC T PROD CT OLETE UTE PRODU OBS BSTIT Data Sheet 5 LE S U FA140 POSSIB HA-5104, H
(R)
HA5025
May 2003 FN3591.6
Quad, 125MHz Video Current Feedback Amplifier
The HA5025 is a wide bandwidth high slew rate quad amplifier optimized for video applications and gains between 1 and 10. It is a current feedback amplifier and thus yields less bandwidth degradation at high closed loop gains than voltage feedback amplifiers. The low differential gain and phase, 0.1dB gain flatness, and ability to drive two back terminated 75 cables, make this amplifier ideal for demanding video applications. The current feedback design allows the user to take advantage of the amplifier's bandwidth dependency on the feedback resistor. The performance of the HA5025 is very similar to the popular Intersil HA-5020.
Features
* Wide Unity Gain Bandwidth . . . . . . . . . . . . . . . . . 125MHz * Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475V/s * Input Offset Voltage . . . . . . . . . . . . . . . . . . . . . . . . 800V * Differential Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.03% * Differential Phase. . . . . . . . . . . . . . . . . . . . . 0.03 Degrees * Supply Current (per Amplifier) . . . . . . . . . . . . . . . . 7.5mA * ESD Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4000V * Guaranteed Specifications at 5V Supplies
Applications
* Video Gain Block * Video Distribution Amplifier/RGB Amplifier * Flash A/D Driver
Pinout
HA5025 (PDIP, SOIC) TOP VIEW
OUT1 1 -IN1 2 +IN1 3 V+ 4 +IN2 5 -IN2 6 OUT2 7 + + + + 14 OUT4 13 -IN4 12 +IN4 11 V10 +IN3 9 -IN3 8 OUT3
* Current to Voltage Converter * Medical Imaging * Radar and Imaging Systems * Video Switching and Routing
Part Number Information
PART NUMBER HA5025IP HA5025IB HA5025EVAL TEMP. RANGE (oC) -40 to 85 -40 to 85 PACKAGE 14 Ld PDIP 14 Ld SOIC PKG. DWG.# E14.3 M14.15
High Speed Op Amp DIP Evaluation Board
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2003. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
HA5025
Absolute Maximum Ratings
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 36V DC Input Voltage (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . VSUPPLY Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10V Output Current (Note 4) . . . . . . . . . . . . . . . . . Short Circuit Protected ESD Rating (Note 3) Human Body Model (Per MIL-STD-883 Method 3015.7) . . 2000V
Thermal Information
Thermal Resistance (Typical, Note 2)
JA (oC/W)
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC Supply Voltage Range (Typical) . . . . . . . . . . . . . . . . 4.5V to 15V
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Maximum Junction Temperature (Note 1) . . . . . . . . . . . . . . . . 175C Maximum Junction Temperature (Plastic Package, Note 1) . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. Maximum power dissipation, including output load, must be designed to maintain junction temperature below 175oC for die, and below 150oC for plastic packages. See Application Information section for safe operating area information. 2. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 3. The non-inverting input of unused amplifiers must be connected to GND. 4. Output is protected for short circuits to ground. Brief short circuits to ground will not degrade reliability, however, continuous (100% duty cycle) output current should not exceed 15mA for maximum reliability.
Electrical Specifications
VSUPPLY = 5V, RF = 1k, AV = +1, RL = 400, CL 10pF, Unless Otherwise Specified (NOTE 9) TEST LEVEL TEMP. (oC)
PARAMETER INPUT CHARACTERISTICS Input Offset Voltage (VIO) Delta VIO Between Channels Average Input Offset Voltage Drift VIO Common Mode Rejection Ratio VIO Power Supply Rejection Ratio Input Common Mode Range Non-Inverting Input (+IN) Current
TEST CONDITIONS
MIN
TYP
MAX
UNITS
A A A B Note 5 3.5V VS 6.5V Note 5 A A A A A A A
25 Full Full Full 25 Full 25 Full Full 25 Full 25 Full 25 Full 25, 85 -40 25, 85 -40 25 Full 25 Full
53 50 60 55 2.5 -
0.8 1.2 5 3 4 10 6 10 -
3 5 3.5 8 20 0.15 0.5 0.1 0.3 12 30 15 30 0.4 1.0 0.2 0.5
mV mV mV V/oC dB dB dB dB V A A A/V A/V A/V A/V A A A A A/V A/V A/V A/V
+IN Common Mode Rejection (+IBCMR = 1 ) +RIN +IN Power Supply Rejection
Note 5
A A
3.5V VS 6.5V
A A
Inverting Input (-IN) Current
A A
Delta - IN BIAS Current Between Channels
A A
-IN Common Mode Rejection
Note 5 3.5V VS 6.5V
A A
-IN Power Supply Rejection
A A
2
HA5025
Electrical Specifications
VSUPPLY = 5V, RF = 1k, AV = +1, RL = 400, CL 10pF, Unless Otherwise Specified (Continued) (NOTE 9) TEST LEVEL B B B TEMP. (oC) 25 25 25
PARAMETER Input Noise Voltage +Input Noise Current -Input Noise Current TRANSFER CHARACTERISTICS Transimpedance
TEST CONDITIONS f = 1kHz f = 1kHz f = 1kHz
MIN -
TYP 4.5 2.5 25.0
MAX -
UNITS nV/Hz pA/Hz pA/Hz
Note 11 RL = 400, VOUT = 2.5V RL = 100, VOUT = 2.5V
A A
25 Full 25 Full 25 Full
1.0 0.85 70 65 50 45 2.5 2.5 16.6 40
3.0 3.0 20.0 60
-
M M dB dB dB dB
Open Loop DC Voltage Gain
A A
Open Loop DC Voltage Gain
A A
OUTPUT CHARACTERISTICS Output Voltage Swing RL = 150 RL = 150 VIN = 2.5V, VOUT = 0V A A Output Current Output Current, Short Circuit POWER SUPPLY CHARACTERISTICS Supply Voltage Range Quiescent Supply Current AC CHARACTERISTICS (AV = +1) Slew Rate Full Power Bandwidth Rise Time Fall Time Propagation Delay Overshoot -3dB Bandwidth Settling Time to 1% Settling Time to 0.25% AC CHARACTERISTICS (AV = +2, RF = 681) Slew Rate Full Power Bandwidth Rise Time Fall Time Propagation Delay Overshoot -3dB Bandwidth Settling Time to 1% Settling Time to 0.25% Gain Flatness VOUT = 100mV 2V Output Step 2V Output Step 5MHz 20MHz Note 6 Note 7 Note 8 Note 8 Note 8 B B B B B B B B B B B 25 25 25 25 25 25 25 25 25 25 25 475 26 6 6 6 12 95 50 100 0.02 0.07 V/s MHz ns ns ns % MHz ns ns dB dB VOUT = 100mV 2V Output Step 2V Output Step Note 6 Note 7 Note 8 Note 8 Note 8 B B B B B B B B B 25 25 25 25 25 25 25 25 25 275 22 350 28 6 6 6 4.5 125 50 75 V/s MHz ns ns ns % MHz ns ns A A 25 Full 5 7.5 15 10 V mA/Op Amp B A 25 Full Full Full V V mA mA
3
HA5025
Electrical Specifications
VSUPPLY = 5V, RF = 1k, AV = +1, RL = 400, CL 10pF, Unless Otherwise Specified (Continued) (NOTE 9) TEST LEVEL TEMP. (oC)
PARAMETER AC CHARACTERISTICS (AV = +10, RF = 383) Slew Rate Full Power Bandwidth Rise Time Fall Time Propagation Delay Overshoot -3dB Bandwidth Settling Time to 1% Settling Time to 0.1% VIDEO CHARACTERISTICS Differential Gain (Note 10) Differential Phase (Note 10) NOTES:
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Note 6 Note 7 Note 8 Note 8 Note 8
B B B B B B
25 25 25 25 25 25 25 25 25
350 28 -
475 38 8 9 9 1.8 65 75 130
-
V/s MHz ns ns ns % MHz ns ns
VOUT = 100mV 2V Output Step 2V Output Step
B B B
RL = 150 RL = 150
B B
25 25
-
0.03 0.03
-
% Degrees
5. VCM = 2.5V. At -40oC Product is tested at VCM = 2.25V because Short Test Duration does not allow self heating. 6. VOUT switches from -2V to +2V, or from +2V to -2V. Specification is from the 25% to 75% points. Slew Rate7. FPBW = ---------------------------- ; V = 2V . 2V PEAK PEAK 8. RL = 100, VOUT = 1V. Measured from 10% to 90% points for rise/fall times; from 50% points of input and output for propagation delay. 9. A. Production Tested; B. Typical or Guaranteed Limit based on characterization; C. Design Typical for information only. 10. Measured with a VM700A video tester using an NTC-7 composite VITS. 11. VOUT = 2.5V. At -40oC Product is tested at VOUT = 2.25V because Short Test Duration does not allow self heating.
Test Circuits and Waveforms
+
DUT
50 HP4195 NETWORK ANALYZER 50
FIGURE 1. TEST CIRCUIT FOR TRANSIMPEDANCE MEASUREMENTS
(NOTE 12) 100 VIN 50 +
(NOTE 12) 100 DUT VOUT RL 100 VIN 50 RI 681 +
DUT VOUT RL 400
-
-
RF , 681
RF , 1k
FIGURE 2. SMALL SIGNAL PULSE RESPONSE CIRCUIT
FIGURE 3. LARGE SIGNAL PULSE RESPONSE CIRCUIT
4
HA5025 Test Circuits and Waveforms
NOTE: 12. A series input resistor of 100 is recommended to limit input currents in case input signals are present before the HA5025 is powered up. (Continued)
Vertical Scale: VIN = 100mV/Div., VOUT = 100mV/Div. FIGURE 4. SMALL SIGNAL RESPONSE
Vertical Scale: VIN = 1V/Div., VOUT = 1V/Div. Horizontal Scale: 50ns/Div. FIGURE 5. LARGE SIGNAL RESPONSE
Schematic Diagram
V+ R2 800 R5 2.5K
(One Amplifier of Four)
R10 820
QP8
QP9 QP11
R15 400
R19 400 QP14 R17 280 R18 280 R20 140
R27 200
R29 9.5 QP19 R31 5
QP1 QN5
QP5
R11 1K
R24 140 QP16
QP10 QN12 R1 60K QN1 R3 6K QP4 QN8 QP2 QN6 QP6 R12 280 +IN QP12 -IN
QP20
C1 1.4pF
QP15 R28 20 QP17
QN13 QP13 C2 1.4pF QN15
QN17 R25 20
QN2 QN10 D1 QN4 QP7 R13 1K R9 820 QN9 R14 280 QN14 R16 400 QN11 R22 280
R21 140
QN21 R25 140 QN18 QN16 R23 400 R26 200 QN19 R30 7 OUT R32 5
QN3 R4 800 VR33 800
QN7
5
HA5025 Application Information
Optimum Feedback Resistor
The plots of inverting and non-inverting frequency response, see Figure 8 and Figure 9 in the typical performance section, illustrate the performance of the HA5025 in various closed loop gain configurations. Although the bandwidth dependency on closed loop gain isn't as severe as that of a voltage feedback amplifier, there can be an appreciable decrease in bandwidth at higher gains. This decrease may be minimized by taking advantage of the current feedback amplifier's unique relationship between bandwidth and RF . All current feedback amplifiers require a feedback resistor, even for unity gain applications, and RF , in conjunction with the internal compensation capacitor, sets the dominant pole of the frequency response. Thus, the amplifier's bandwidth is inversely proportional to RF . The HA5025 design is optimized for a 1000 RF at a gain of +1. Decreasing RF in a unity gain application decreases stability, resulting in excessive peaking and overshoot. At higher gains the amplifier is more stable, so RF can be decreased in a trade-off of stability for bandwidth. The following table lists recommended RF values for various gains, and the expected bandwidth.
GAIN (ACL) -1 +1 +2 +5 +10 -10 BANDWIDTH (MHz) 100 125 95 52 65 22
-IN, and that connections to -IN be kept as short as possible to minimize the capacitance from this node to ground.
Driving Capacitive Loads
Capacitive loads will degrade the amplifier's phase margin resulting in frequency response peaking and possible oscillations. In most cases the oscillation can be avoided by placing an isolation resistor (R) in series with the output as shown in Figure 6.
100 VIN RT RI RF + R VOUT CL
-
FIGURE 6. PLACEMENT OF THE OUTPUT ISOLATION RESISTOR, R
The selection criteria for the isolation resistor is highly dependent on the load, but 27 has been determined to be a good starting value.
Power Dissipation Considerations
Due to the high supply current inherent in quad amplifiers, care must be taken to insure that the maximum junction temperature (TJ , see Absolute Maximum Ratings) is not exceeded. Figure 7 shows the maximum ambient temperature versus supply voltage for the available package styles (PDIP, SOIC). At VS = 5V quiescent operation both package styles may be operated over the full industrial range of -40oC to 85oC. It is recommended that thermal calculations, which take into account output power, be performed by the designer.
RF () 750 1000 681 1000 383 750
PC Board Layout
The frequency response of this amplifier depends greatly on the amount of care taken in designing the PC board. The use of low inductance components such as chip resistors and chip capacitors is strongly recommended. If leaded components are used the leads must be kept short especially for the power supply decoupling components and those components connected to the inverting input. Attention must be given to decoupling the power supplies. A large value (10F) tantalum or electrolytic capacitor in parallel with a small value (0.1F) chip capacitor works well in most cases. A ground plane is strongly recommended to control noise. Care must also be taken to minimize the capacitance to ground seen by the amplifier's inverting input (-IN). The larger this capacitance, the worse the gain peaking, resulting in pulse overshoot and possible instability. It is recommended that the ground plane be removed under traces connected to
MAX AMBIENT TEMPERATURE (oC)
130 120 110 100 90 80 70 60 50 40 30 20 10 5 7 9 11 13 15 SOIC PDIP
SUPPLY VOLTAGE (V)
FIGURE 7. MAXIMUM OPERATING AMBIENT TEMPERATURE vs SUPPLY VOLTAGE
6
HA5025 Typical Performance Curves
5 4 NORMALIZED GAIN (dB) 3 2 1 0 -1 -2 -3 -4 -5 2 10 FREQUENCY (MHz) 100 200 AV = 10, RF = 383 VOUT = 0.2VP-P CL = 10pF AV = 2, RF = 681 AV = 5, RF = 1k AV = +1, RF = 1k NORMALIZED GAIN (dB)
VSUPPLY = 5V, AV = +1, RF = 1k, RL = 400, TA = 25oC, Unless Otherwise Specified
5 4 3 2 1 0 -1 -2 -3 -4 -5 2 10 FREQUENCY (MHz) 100 200 AV = -10 AV = -5 VOUT = 0.2VP-P CL = 10pF RF = 750 AV = -1
AV = -2
FIGURE 8. NON-INVERTING FREQUENCY RESPONSE
FIGURE 9. INVERTING FREQUENCY RESPONSE
-3dB BANDWIDTH (MHz)
140 VOUT = 0.2VP-P CL = 10pF AV = +1
NONINVERTING PHASE (DEGREES)
0 -45 -90 -135 -100 -225 -270 -315 -360 2 VOUT = 0.2VP-P CL = 10pF 10 AV = -1, RF = 750 AV = +10, RF = 383
135 90 45 0 -45 AV = -10, RF = 750 -90 -135 -180 100 200
INVERTING PHASE (DEGREES)
AV = +1, RF = 1k
180
130
5 GAIN PEAKING 500 700 900 1100 1300 FEEDBACK RESISTOR () 0 1500
FREQUENCY (MHz)
FIGURE 10. PHASE RESPONSE AS A FUNCTION OF FREQUENCY
FIGURE 11. BANDWIDTH AND GAIN PEAKING vs FEEDBACK RESISTANCE
-3dB BANDWIDTH (MHz)
100 VOUT = 0.2VP-P CL = 10pF AV = +2 95
130
-3dB BANDWIDTH (MHz)
120 -3dB BANDWIDTH 110 6 GAIN PEAKING (dB)
-3dB BANDWIDTH GAIN PEAKING (dB) 90 10
100
4
5 GAIN PEAKING 350 500 650 800 950 FEEDBACK RESISTOR () 0 1100
90
GAIN PEAKING
80 0 200 400 600
VOUT = 0.2VP-P 2 CL = 10pF AV = +1 0 800 1000
LOAD RESISTOR ()
FIGURE 12. BANDWIDTH AND GAIN PEAKING vs FEEDBACK RESISTANCE
FIGURE 13. BANDWIDTH AND GAIN PEAKING vs LOAD RESISTANCE
7
GAIN PEAKING (dB)
120
-3dB BANDWIDTH
10
HA5025 Typical Performance Curves
80 VOUT = 0.2VP-P CL = 10pF AV = +10 -3dB BANDWIDTH (MHz) 60 OVERSHOOT (%) 12
VSUPPLY = 5V, AV = +1, RF = 1k, RL = 400, TA = 25oC, Unless Otherwise Specified (Continued)
16 VOUT = 0.1VP-P CL = 10pF VSUPPLY = 5V, AV = +2
40
6
VSUPPLY = 15V, AV = +2 VSUPPLY = 5V, AV = +1 VSUPPLY = 15V, AV = +1
20
0 200 350 500 650 FEEDBACK RESISTOR () 800 950
0 0 200 400 600 LOAD RESISTANCE () 800 1000
FIGURE 14. BANDWIDTH vs FEEDBACK RESISTANCE
0.10 FREQUENCY = 3.58MHz DIFFERENTIAL GAIN (%) 0.08 RL = 75
FIGURE 15. SMALL SIGNAL OVERSHOOT vs LOAD RESISTANCE
0.08 FREQUENCY = 3.58MHz DIFFERENTIAL PHASE (DEGREES)
0.06
0.06 RL = 150
0.04 RL = 150 RL = 75
0.04
0.02 RL = 1k 0.00 3 5 7 9 11 13 15
0.02 RL = 1k 0.00 3 5 7 9 11 13 15 SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
FIGURE 16. DIFFERENTIAL GAIN vs SUPPLY VOLTAGE
-40 VOUT = 2.0VP-P CL = 30pF
FIGURE 17. DIFFERENTIAL PHASE vs SUPPLY VOLTAGE
0 REJECTION RATIO (dB) -10 -20 -30 -40 -50 -60 -70 -80 HD3
AV = +1
-50 DISTORTION (dBc) HD2 -60 3RD ORDER IMD -70 HD2 HD3 -80
CMRR
NEGATIVE PSRR POSITIVE PSRR 0.01 0.1 FREQUENCY (MHz) 1 10 30
-90 0.3
1 FREQUENCY (MHz)
10
0.001
FIGURE 18. DISTORTION vs FREQUENCY
FIGURE 19. REJECTION RATIOS vs FREQUENCY
8
HA5025 Typical Performance Curves
8.0 RL = 100 VOUT = 1.0VP-P AV = +1 7.5
VSUPPLY = 5V, AV = +1, RF = 1k, RL = 400, TA = 25oC, Unless Otherwise Specified (Continued)
12 RLOAD = 100 VOUT = 1.0VP-P PROPAGATION DELAY (ns) 10 AV = +10, RF = 383
PROPAGATION DELAY (ns)
7.0
8 AV = +2, RF = 681 6 AV = +1, RF = 1k
6.5
6.0 -50 -25 0 25 50 75 TEMPERATURE (oC) 100 125
4 3 5 7 9 11 SUPPLY VOLTAGE (V) 13 15
FIGURE 20. PROPAGATION DELAY vs TEMPERATURE
500 VOUT = 2VP-P 450 SLEW RATE (V/s)
FIGURE 21. PROPAGATION DELAY vs SUPPLY VOLTAGE
0.8 0.6 NORMALIZED GAIN (dB) VOUT = 0.2VP-P CL = 10pF
400 350 300 250 200 150
+ SLEW RATE
0.4 0.2 0 -0.2 -0.4 -0.6
AV= +2, RF = 681
- SLEW RATE
AV= +5, RF = 1k AV = +1, RF = 1k
-0.8 -1.0 AV = +10, RF = 383 5 10 15 20 FREQUENCY (MHz) 25 30
100 -50 -25 0 25 50 75 100 125 TEMPERATURE (oC)
-1.2
FIGURE 22. SLEW RATE vs TEMPERATURE
FIGURE 23. NON-INVERTING GAIN FLATNESS vs FREQUENCY
0.8 0.6 NORMALIZED GAIN (dB) 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 5 10 15 20 25 30 FREQUENCY (MHz) AV = -10 AV = -2 AV = -5 AV = -1 VOUT = 0.2VP-P CL = 10pF RF = 750
100 AV = +10, RF = 383 VOLTAGE NOISE (nV/Hz)
1000
60 +INPUT NOISE CURRENT 40 INPUT NOISE VOLTAGE 20
600
400
200
0 0.01
0.1
1 FREQUENCY (kHz)
10
0 100
FIGURE 24. INVERTING GAIN FLATNESS vs FREQUENCY
FIGURE 25. INPUT NOISE CHARACTERISTICS
9
CURRENT NOISE (pA/Hz)
80
-INPUT NOISE CURRENT
800
HA5025 Typical Performance Curves
1.5
VSUPPLY = 5V, AV = +1, RF = 1k, RL = 400, TA = 25oC, Unless Otherwise Specified (Continued)
2
1.0 VIO (mV)
BIAS CURRENT (A)
0
0.5
-2
0.0 -60
-40
-20
0
20
40
60
80
100
120
140
-4 -60
-40
-20
0
20
40
60
80
100
120
140
TEMPERATURE (oC)
TEMPERATURE (oC)
FIGURE 26. INPUT OFFSET VOLTAGE vs TEMPERATURE
22
FIGURE 27. +INPUT BIAS CURRENT vs TEMPERATURE
4000
TRANSIMPEDANCE (k) -40 -20 0 20 40 60 80 100 120 140
BIAS CURRENT (A)
20
3000
18
2000
16 -60
1000 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (oC)
TEMPERATURE (oC)
FIGURE 28. -INPUT BIAS CURRENT vs TEMPERATURE
FIGURE 29. TRANSIMPEDANCE vs TEMPERATURE
25 125oC 20 ICC (mA) 55oC REJECTION RATIO (dB)
74 72 70 68 66 64 62 60 58 -100 CMRR -PSRR +PSRR
15
10 25oC 5
3
4
5
6
7
8
9
10
11
12
13
14
15
-50
0
50
100
150
200
250
SUPPLY VOLTAGE (V)
TEMPERATURE (oC)
FIGURE 30. SUPPLY CURRENT vs SUPPLY VOLTAGE
FIGURE 31. REJECTION RATIO vs TEMPERATURE
10
HA5025 Typical Performance Curves
40
VSUPPLY = 5V, AV = +1, RF = 1k, RL = 400, TA = 25oC, Unless Otherwise Specified (Continued)
4.0
SUPPLY CURRENT (mA)
OUTPUT SWING (V) 3 4 5 6 7 8 9 10 11 12 13 14 15
30
+5V
+10V
+15V
20
3.8
10
0 0
1
2
3.6 -60
-40
-20
0
20
40
60
80
100
120
140
DISABLE INPUT VOLTAGE (V)
TEMPERATURE (oC)
FIGURE 32. SUPPLY CURRENT vs DISABLE INPUT VOLTAGE
FIGURE 33. OUTPUT SWING vs TEMPERATURE
30 VS = 15V
1.2
1.1 VOUT (VP-P) 20 VS = 10V 10 0.9 VS = 4.5V 0 0.01 0.10 1.00 10.00 LOAD RESISTANCE (k) 0.8 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (oC) VIO (mV) 1.0
FIGURE 34. OUTPUT SWING vs LOAD RESISTANCE
FIGURE 35. INPUT OFFSET VOLTAGE CHANGE BETWEEN CHANNELS vs TEMPERATURE
1.5
-30 AV = +1 VOUT = 2VP-P
BIAS CURRENT (A)
-40 SEPARATION (dB) -40 -20 0 20 40 60 80 TEMPERATURE (oC) 100 120 140 1.0
-50
0.5
-60
-70 0.0 -60 -80 0.1 1 FREQUENCY (MHz) 10 30
FIGURE 36. INPUT BIAS CURRENT CHANGE BETWEEN CHANNELS vs TEMPERATURE
FIGURE 37. CHANNEL SEPARATION vs FREQUENCY
11
HA5025 Typical Performance Curves
VSUPPLY = 5V, AV = +1, RF = 1k, RL = 400, TA = 25oC, Unless Otherwise Specified (Continued)
0 -10 FEEDTHROUGH (dB) -20 -30 -40 -50 -60 -70 -80 0.1
DISABLE = 0V VIN = 5VP-P RF = 750
TRANSIMPEDANCE (M)
10 1 0.1 0.01 0.001 180 135 90 45 0 -45 -90 PHASE ANGLE (DEGREES) RL = 100
1 FREQUENCY (MHz)
10
20
0.001
0.01
0.1 1 FREQUENCY (MHz)
10
-135 100
FIGURE 38. DISABLE FEEDTHROUGH vs FREQUENCY
FIGURE 39. TRANSIMPEDANCE vs FREQUENCY
TRANSIMPEDANCE (M)
10 1 0.1 PHASE ANGLE (DEGREES) 0.01 0.001 180 135 90 45 0 -45 -90 -135 0.001 0.01 0.1 1 10 FREQUENCY (MHz) 100 RL = 400
FIGURE 40. TRANSIMPEDANCE vs FREQUENCY
12
HA5025 Die Characteristics
DIE DIMENSIONS: 2010m x 3130m x 483m METALLIZATION: Type: Metal 1: AlCu (1%) Thickness: Metal 1: 8kA 0.4kA Metal 2: AlCu (1%) Metal 2: 16kA 0.8kA SUBSTRATE POTENTIAL (Powered Up): VTRANSISTOR COUNT: 248 PROCESS: High Frequency Bipolar Dielectric Isolation PASSIVATION: Type: Nitride Thickness: 4kA 0.4kA
Metallization Mask Layout
HA5025
OUT1 OUT4 -IN1 -IN4
+IN1
+IN4
V+
V-
+IN2
+IN3
OUT2
OUT3
-IN2
13
-IN3
HA5025 Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 12 3 N/2
E14.3 (JEDEC MS-001-AA ISSUE D)
14 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL
-B-
MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 18.66 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 19.68 8.25 7.11 NOTES 4 4 8 5 5 6 5 6 7 4 9 Rev. 0 12/93
MIN 0.015 0.115 0.014 0.045 0.008 0.735 0.005 0.300 0.240
MAX 0.210 0.195 0.022 0.070 0.014 0.775 0.325 0.280
-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A2 L A C L E
A A1 A2 B B1 C D D1 E
-C-
eA eC
C
e
C A BS
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 1.14mm).
E1 e eA eB L N
0.100 BSC 0.300 BSC 0.115 14 0.430 0.150 -
2.54 BSC 7.62 BSC 10.92 3.81 14
2.93
14
HA5025 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M14.15 (JEDEC MS-012-AB ISSUE C)
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 1.35 0.10 0.33 0.19 8.55 3.80 MAX 1.75 0.25 0.51 0.25 8.75 4.00 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0532 0.0040 0.013 0.0075 0.3367 0.1497
MAX 0.0688 0.0098 0.020 0.0098 0.3444 0.1574
A1 B C D E

A1 0.10(0.004) C
e
B 0.25(0.010) M C AM BS
e H h L N
0.050 BSC 0.2284 0.0099 0.016 14 0o 8o 0.2440 0.0196 0.050
1.27 BSC 5.80 0.25 0.40 14 0o 6.20 0.50 1.27
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
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